| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2 NPN transistors contained in one package, facilitating high-density mounting. · The FX504 houses two chips, each being equivalent to the 2SD1802, in one package. · Matched pair characteristics. Package Dimensions unit:mm 2118 |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2 PNP transistors contained in one package, facilitating high-density mounting. · The FX505 houses two chips, each being equivalent to the 2SB1203, in one package. · Matched pair characteristics. Package Dimensions unit:mm 2118 |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2PNP transistors contained in one package, facilitating high-density mounting. · The FX509 houses two chips, each being equivalent to the 2SB1215, in one package. · Matched pair characteristics. Package Dimensions unit:mm 2118 |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2 PNP transistors contained in one package, facilitating high-density mounting. · The FX501 houses two chips, each being equivalent to the 2SB1205, in one package. · Matched pair characteristics. Package Dimensions unit:mm 2118 |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2 NPN transistors contained in one package, facilitating high-density mounting. · The FX502 houses two chips, each being equivalent to the 2SD1805, in one package. · Matched pair characteristics. Package Dimensions unit:mm 2118 |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2 PNP transistors contained in one package, facilitating high-density mounting. · The FX503 houses two chips, each being equivalent to the 2SB1202, in one package. · Matched pair characteristics. Package Dimensions unit:mm 2118 |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2PNP transistors contained in one package, facilitating high-density mounting. · The FX506 houses two chips, each being equivalent to the 2SD1803, in one package. · Matched pair characteristics. Package Dimensions unit:mm 2118 |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2PNP transistors contained in one package, facilitating high-density mounting. · The FX507 houses two chips, each being equivalent to the 2SC3647, in one package. · Matched pair characteristics. 1:Base1 2:Emitter1 3:Emitter2 4: |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2PNP transistors contained in one package, facilitating high-density mounting. · The FX510 houses two chips, each being equivalent to the 2SA1552, in one package. · Matched pair characteristics. Package Dimensions unit:mm 2118 |
|
|
|
|
Sanyo Semicon Device |
High-Current Switching Applications · Composite type with 2PNP transistors contained in one package, facilitating high-density mounting. · The FX508 houses two chips, each being equivalent to the 2SD1815, in one package. · Matched pair characteristics. 1:Base1 2:Emitter1 3:Emitter2 4: |
|