Sangdest Microelectronics RS2 fiche technique

No.	Partie #	Fabricant	Description
1	RS2M	Sangdest Microelectronics	FAST RECOVERY RECTIFIERS • Fast switching for high efficiency • Low leakage current • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Mechanical Data: • Case: SMB molded plastic body • Terminals: Solde
2	RS2D	Sangdest Microelectronics	FAST RECOVERY RECTIFIERS • Fast switching for high efficiency • Low leakage current • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Mechanical Data: • Case: SMB molded plastic body • Terminals: Solde
3	RS2K	Sangdest Microelectronics	FAST RECOVERY RECTIFIERS • Fast switching for high efficiency • Low leakage current • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Mechanical Data: • Case: SMB molded plastic body • Terminals: Solde
4	RS2J	Sangdest Microelectronics	FAST RECOVERY RECTIFIERS • Fast switching for high efficiency • Low leakage current • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Mechanical Data: • Case: SMB molded plastic body • Terminals: Solde
5	RS2G	Sangdest Microelectronics	FAST RECOVERY RECTIFIERS • Fast switching for high efficiency • Low leakage current • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Mechanical Data: • Case: SMB molded plastic body • Terminals: Solde
6	RS2B	Sangdest Microelectronics	FAST RECOVERY RECTIFIERS • Fast switching for high efficiency • Low leakage current • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Mechanical Data: • Case: SMB molded plastic body • Terminals: Solde
7	RS2A	Sangdest Microelectronics	FAST RECOVERY RECTIFIERS • Fast switching for high efficiency • Low leakage current • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Mechanical Data: • Case: SMB molded plastic body • Terminals: Solde