No. | Partie # | Fabricant | Description | Fiche Technique |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 ℃ TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness and long term reliability • |
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Sangdest Microelectronics |
SCHOTTKY RECTIFIER • 150°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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Sangdest Microelectronics |
SCHOTTKY RECTIFIER 150℃ TJ operation Center tap configuration Low forward voltage drop High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance High frequency operation Guard ring for enhanced ruggedness and |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 ℃ TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 175 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 175 ℃ TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER Applications 150 C TJ operation Center tap configuration Low forward voltage drop High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance High frequency operation |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 ℃ TJ operation • Center tap TO-247AD package • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggednes |
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Sangdest Microelectronics |
SCHOTTKY RECTIFIER LKLLKJHYJ, TO-220AB 150C TJ operation Center tap configuration Low forward voltage drop High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance High frequency operation Guard ring f |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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|
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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|
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C T J operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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