No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
|
|
Sangdest Microelectronics |
Single-Phase 35.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 50A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 35.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 25.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 15.0A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 50A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 35.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 35.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 50A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 25.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 25.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 25.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 25.0A Glass Passivated Bridge Rectifier • Glass passivated die construction • Low forward voltage drop • High current capability • High surge current capability • Plastic material-UL flammability 94V-0 Mechanical Data: • Case: GBPC, Molded plastic • Terminals: Plated leads solderable per |
|
|
|
Sangdest Microelectronics |
Single-Phase 15.0A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 15.0A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 15.0A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 50A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 50A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 50A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|
|
|
Sangdest Microelectronics |
Single-Phase 50A Glass Passivated Bridge Rectifier Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting Typical IR less than 0.3 μA High surge current capability Low thermal resistance Solder Dip 260 °C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEEE 2 |
|