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Samsung CIM DataSheet

No. Partie # Fabricant Description Fiche Technique
1
CIM05U471

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
2
CIM05U241

Samsung
Chip Bead
Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for high reli
Datasheet
3
CIM05U301

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
4
CIM05U300

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
5
CIM05J102

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
6
CIM10U241

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
7
CIM10J152

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
8
CIM10U221

Samsung
Chip Bead

 Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or reflow soldering
 Monolithic inorganic material construction for high reliability
 Closed magnetic circuit configu
Datasheet
9
CIM05U300

Samsung
Chip Bead
Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for high reli
Datasheet
10
CIM05F121

Samsung
Chip Bead
Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for high reli
Datasheet
11
CIM05U121

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
12
CIM05U241

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
13
CIM05J600

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
14
CIM05J121

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
15
CIM05J471

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
16
CIM10U202

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
17
CIM10J151

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
18
CIM10J241

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
19
CIM10J471

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet
20
CIM10J102

Samsung
Chip Bead
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for
Datasheet



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