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Samsung CIB DataSheet

No. Partie # Fabricant Description Fiche Technique
1
CIB10P260

Samsung
Chip Bead

 Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or reflow soldering
 Monolithic inorganic material construction for high reliability
 Closed magnetic circuit configu
Datasheet
2
CIB10P100

Samsung
Chip Bead

 Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or reflow soldering
 Monolithic inorganic material construction for high reliability
 Closed magnetic circuit configu
Datasheet
3
CIB10P220

Samsung
Chip Bead

 Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or reflow soldering
 Monolithic inorganic material construction for high reliability
 Closed magnetic circuit configu
Datasheet
4
CIB10P300

Samsung
Chip Bead

 Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or reflow soldering
 Monolithic inorganic material construction for high reliability
 Closed magnetic circuit configu
Datasheet
5
CIB10P330

Samsung
Chip Bead

 Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or reflow soldering
 Monolithic inorganic material construction for high reliability
 Closed magnetic circuit configu
Datasheet
6
CIB10J300

Samsung
Chip Bead

 Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or reflow soldering
 Monolithic inorganic material construction for high reliability
 Closed magnetic circuit configu
Datasheet



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