| No. | Partie # | Fabricant | Description | Fiche Technique |
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STMicroelectronics |
HIGH SIDE SMART POWER SOLID STATE RELAY |
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STMicroelectronics |
4-line ESD protection • Very compact 500 µm pitch package, for easy PCB layout • Very-large bandwidth: 11.5 GHz (HSP051-4M5), 18 GHz (HSP053-4M5) • Very-low capacitance: 0.35 pF (HSP051-4M5 - I/O to GND), 0.25 pF (HSP053-4M5 - I/O to GND) • Low leakage current: < 1 nA • H |
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STMicroelectronics |
HIGH SIDE SMART POWER SOLID STATE RELAY s) Supply Voltage (pulsed) Reverse Supply Voltage Status Current Electrostat ic Discharge (1.5 k Ω, 100 pF) Power Dissipation at T c ≤ 25 C o Parameter Drain-Source Breakdown Voltage Value Internally Clamped 12 -12 ± 10 40 60 -4 ± 10 2000 52 -40 to |
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STMicroelectronics |
4-line ESD protection Flow-through routing to keep signal integrity Ultralarge bandwidth: 10 GHz Ultralow capacitance: 0.2 pF (I/O to I/O) 0.35 pF (I/O to GND) Very low dynamic resistance: 0.48 Ω 100 Ω differential impedance Low leakage current: 100 nA at |
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STMicroelectronics |
Automotive 2-line ESD protection 3 2 1 SOT323-3L (Jedec TO-236) Functional diagram Product status link HSP051-2W3Y Product summary Order code HSP051-2W3Y Marking H5Y Package SOT323-3L Packing Tape and reel • AEC-Q101 qualified • Flow-through routing to keep signal inte |
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STMicroelectronics |
Automotive grade 18V dual-line high speed port protection 3 2 1 SOT323-3L (Jedec TO-236) 1 3 2 Functional diagram Product status link HSP181-2W3Y Product summary Order code HSP181-2W3Y Marking H8Y Package SOT323-3L Packing Tape and reel • AEC-Q101 qualified • Flow-through routing to keep signal |
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STMicroelectronics |
4-line ESD protection • Very compact 500 µm pitch package, for easy PCB layout • Very-large bandwidth: 11.5 GHz (HSP051-4M5), 18 GHz (HSP053-4M5) • Very-low capacitance: 0.35 pF (HSP051-4M5 - I/O to GND), 0.25 pF (HSP053-4M5 - I/O to GND) • Low leakage current: < 1 nA • H |
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