| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
|
|
|
STATS ChipPAC |
Small Outline Packages TSSOP • Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm • Lead Count: 8L to 56L • Lead Pitch: 0.50mm & 0.65mm • Package Height: 1.20mm max. • JEDEC standard compliant (MO-153) • Lead-free (Pb-free) and Green • Thermal Enhancements: ep (exposed pad) MSOP • Bod |
|