| No. | Partie # | Fabricant | Description | Fiche Technique |
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SPANSION |
S71PL032J40BAWOK |
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SPANSION |
(S71PLxxx) STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM Power supply voltage of 2.7 to 3.1 volt High performance — 55 ns — 65 ns (65 ns Flash, 70ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — |
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SPANSION |
Based MCPs Power supply voltage of 2.7 V to 3.1 V High performance — 65 ns (65 ns Flash, 70 ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — –40°C |
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SPANSION |
Based MCPs Power supply voltage of 2.7 V to 3.1 V High performance — 65 ns (65 ns Flash, 70 ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — –40°C |
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SPANSION |
MirrorBit MCPs Speed – Flash: 70 ns – pSRAM: 70 ns S71PL129NC0 S71PL127NB0 S71PL127NC0 8.0 x 11.6 x 1.2 mm Packages – 84-Ball Fine-Pitch Ball Grid Array (FBGA) S71PL256NC0 S71PL256ND0 – 64 Ball Fine-Pitch Ball Grid Array (FBGA) S71PL129NB0 Speed – Flash: 70 |
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SPANSION |
MirrorBit MCPs Speed – Flash: 70 ns – pSRAM: 70 ns S71PL129NC0 S71PL127NB0 S71PL127NC0 8.0 x 11.6 x 1.2 mm Packages – 84-Ball Fine-Pitch Ball Grid Array (FBGA) S71PL256NC0 S71PL256ND0 – 64 Ball Fine-Pitch Ball Grid Array (FBGA) S71PL129NB0 Speed – Flash: 70 |
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SPANSION |
Stacked Multi-Chip Product (MCP) Flash Memory Power supply voltage of 2.7 to 3.1 volt High performance — 65ns (65ns Flash, 70ns pSRAM) Package — 8 x 11.6 x 1.2 mm 64 ball FBGA Operating Temperature — –25°C to +85°C (Wireless) — –40°C to +85°C (Industrial) Dual CE# Flash memory Genera |
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SPANSION |
Stacked Multi-Chip Product (MCP) Flash Memory Power supply voltage of 2.7 to 3.1 volt High performance — 65ns (65ns Flash, 70ns pSRAM) Package — 8 x 11.6 x 1.2 mm 64 ball FBGA Operating Temperature — –25°C to +85°C (Wireless) — –40°C to +85°C (Industrial) Dual CE# Flash memory Genera |
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SPANSION |
(S71PLxxx) STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM Power supply voltage of 2.7 to 3.1 volt High performance — 55 ns — 65 ns (65 ns Flash, 70ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — |
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SPANSION |
(S71PLxxx) STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM Power supply voltage of 2.7 to 3.1 volt High performance — 55 ns — 65 ns (65 ns Flash, 70ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — |
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SPANSION |
(S71PLxxx) STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM Power supply voltage of 2.7 to 3.1 volt High performance — 55 ns — 65 ns (65 ns Flash, 70ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — |
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SPANSION |
Based MCPs Power supply voltage of 2.7 V to 3.1 V High performance — 65 ns (65 ns Flash, 70 ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — –40°C |
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SPANSION |
Based MCPs Power supply voltage of 2.7 V to 3.1 V High performance — 65 ns (65 ns Flash, 70 ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — –40°C |
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SPANSION |
MirrorBit MCPs Speed – Flash: 70 ns – pSRAM: 70 ns S71PL129NC0 S71PL127NB0 S71PL127NC0 8.0 x 11.6 x 1.2 mm Packages – 84-Ball Fine-Pitch Ball Grid Array (FBGA) S71PL256NC0 S71PL256ND0 – 64 Ball Fine-Pitch Ball Grid Array (FBGA) S71PL129NB0 Speed – Flash: 70 |
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SPANSION |
MirrorBit MCPs Speed – Flash: 70 ns – pSRAM: 70 ns S71PL129NC0 S71PL127NB0 S71PL127NC0 8.0 x 11.6 x 1.2 mm Packages – 84-Ball Fine-Pitch Ball Grid Array (FBGA) S71PL256NC0 S71PL256ND0 – 64 Ball Fine-Pitch Ball Grid Array (FBGA) S71PL129NB0 Speed – Flash: 70 |
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SPANSION |
Based MCPs Power supply voltage of 2.7 V to 3.1 V High performance — 65 ns (65 ns Flash, 70 ns pSRAM) Packages — 7 x 9 x 1.2mm 56 ball FBGA — 8 x 11.6 x 1.2mm 64 ball FBGA — 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature — –25°C to +85°C — –40°C |
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SPANSION |
Page-Mode Flash Memory Speed — Flash: 70 ns — pSRAM: 70 ns Packages — 84-Ball Fine-Pitch Ball Grid Array (FBGA), 8.0 x 11.6 x 1.4 mm Operating Temperature Range — Temperature Range of –25°C to +85°C Product Selector Guide MCP S71PL512ND0-5B Flash 2 x S29PL256N pSRAM |
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SPANSION |
Stacked Multi-Chip Product (MCP) Flash Memory Power supply voltage of 2.7 to 3.1 volt High performance — 65ns (65ns Flash, 70ns pSRAM) Package — 8 x 11.6 x 1.2 mm 64 ball FBGA Operating Temperature — –25°C to +85°C (Wireless) — –40°C to +85°C (Industrial) Dual CE# Flash memory Genera |
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