SEMTECH US1 fiche technique

No.	Partie #	Fabricant	Description
1	US1AF	SEMTECH	Surface Mount Ultrafast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mount applications • Low profile package • Easy to pick and place • High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solderable per MIL-STD-750, method 2
2	US1BF	SEMTECH	Surface Mount Ultrafast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mount applications • Low profile package • Easy to pick and place • High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solderable per MIL-STD-750, method 2
3	US1DF	SEMTECH	Surface Mount Ultrafast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mount applications • Low profile package • Easy to pick and place • High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solderable per MIL-STD-750, method 2
4	US1GF	SEMTECH	Surface Mount Ultrafast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mount applications • Low profile package • Easy to pick and place • High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solderable per MIL-STD-750, method 2
5	US1KF	SEMTECH	Surface Mount Ultrafast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mount applications • Low profile package • Easy to pick and place • High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solderable per MIL-STD-750, method 2
6	US1MF	SEMTECH	Surface Mount Ultrafast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mount applications • Low profile package • Easy to pick and place • High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solderable per MIL-STD-750, method 2
7	US1JF	SEMTECH	Surface Mount Ultrafast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mount applications • Low profile package • Easy to pick and place • High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solderable per MIL-STD-750, method 2