No. | Partie # | Fabricant | Description | Fiche Technique |
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SEMTECH |
Surface Mount Fast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Fast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1. |
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SEMTECH |
Surface Mount Fast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Fast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1. |
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|
SEMTECH |
Surface Mount Fast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Fast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1. |
|
|
|
SEMTECH |
Surface Mount Fast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Fast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1. |
|
|
|
SEMTECH |
Surface Mount Fast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Fast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1. |
|
|
|
SEMTECH |
Surface Mount Fast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Fast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1. |
|
|
|
SEMTECH |
Surface Mount Fast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Fast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1. |
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