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SEMTECH RS1 DataSheet

No. Partie # Fabricant Description Fiche Technique
1
RS1DF

SEMTECH
Surface Mount Fast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mounted applications
• Low profile package
• Fast reverse recovery time Mechanical Data
• Case: SMAF
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.
Datasheet
2
RS1MF

SEMTECH
Surface Mount Fast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mounted applications
• Low profile package
• Fast reverse recovery time Mechanical Data
• Case: SMAF
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.
Datasheet
3
RS1AF

SEMTECH
Surface Mount Fast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mounted applications
• Low profile package
• Fast reverse recovery time Mechanical Data
• Case: SMAF
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.
Datasheet
4
RS1GF

SEMTECH
Surface Mount Fast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mounted applications
• Low profile package
• Fast reverse recovery time Mechanical Data
• Case: SMAF
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.
Datasheet
5
RS1JF

SEMTECH
Surface Mount Fast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mounted applications
• Low profile package
• Fast reverse recovery time Mechanical Data
• Case: SMAF
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.
Datasheet
6
RS1KF

SEMTECH
Surface Mount Fast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mounted applications
• Low profile package
• Fast reverse recovery time Mechanical Data
• Case: SMAF
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.
Datasheet
7
RS1BF

SEMTECH
Surface Mount Fast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mounted applications
• Low profile package
• Fast reverse recovery time Mechanical Data
• Case: SMAF
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.
Datasheet



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