| No. | Partie # | Fabricant | Description | Fiche Technique |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Easy pick and place • For surface mounted applications • Low profile package • Superfast recovery times for high efficiency PINNING PIN 1 2 1 DESCRIPTION Cathode Anode 2 Top View Marking Code: ES1AW~ES1DW: ESL ES1GW: ESM ES1JW~ES1MW: ESH Simplif |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Easy pick and place • For surface mounted applications • Low profile package • Superfast recovery times for high efficiency PINNING PIN 1 2 1 DESCRIPTION Cathode Anode 2 Top View Marking Code: ES1AW~ES1DW: ESL ES1GW: ESM ES1JW~ES1MW: ESH Simplif |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Easy pick and place • For surface mounted applications • Low profile package • Superfast recovery times for high efficiency PINNING PIN 1 2 1 DESCRIPTION Cathode Anode 2 Top View Marking Code: ES1AW~ES1DW: ESL ES1GW: ESM ES1JW~ES1MW: ESH Simplif |
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|
|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Easy pick and place • For surface mounted applications • Low profile package • Superfast recovery times for high efficiency PINNING PIN 1 2 1 DESCRIPTION Cathode Anode 2 Top View Marking Code: ES1AW~ES1DW: ESL ES1GW: ESM ES1JW~ES1MW: ESH Simplif |
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|
|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Easy pick and place • For surface mounted applications • Low profile package • Superfast recovery times for high efficiency PINNING PIN 1 2 1 DESCRIPTION Cathode Anode 2 Top View Marking Code: ES1AW~ES1DW: ESL ES1GW: ESM ES1JW~ES1MW: ESH Simplif |
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|
|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Easy pick and place • For surface mounted applications • Low profile package • Superfast recovery times for high efficiency PINNING PIN 1 2 1 DESCRIPTION Cathode Anode 2 Top View Marking Code: ES1AW~ES1DW: ESL ES1GW: ESM ES1JW~ES1MW: ESH Simplif |
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