| No. | Partie # | Fabricant | Description | Fiche Technique |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 200°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 ℃ TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 ℃ TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 175°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER z 150℃ TJ operation z Center tap configuration z Low forward voltage drop z High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance z High frequency operation z Guard ring for enhanced ruggedness an |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 175 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150 °C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness |
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SANGDEST MICROELECTRONICS |
SCHOTTKY RECTIFIER • 150°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness a |
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