| No. | Partie # | Fabricant | Description | Fiche Technique |
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Rohm |
PIN diode 1) Small surface mounting type. (UMD2) 2) Low high-frequency forward resistance (rF) / low capacitance (CT). 3) High reliability. 2.5±0.2 1.7±0.1 2.5±0.2 1.7±0.1 9 0.3±0.2 1.25±0.1 0.2 0.7 + −0.1 0.1 0.1 + −0.05 9 0.3±0.2 1.25±0.1 0.2 0.7 + −0. |
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ROHM |
PIN diode 1) Small mold type. (UMD2) 2) High frequency resistance which is small and low capacity. zConstruction Silicon epitaxial planar 0.3±0.05 ROHM : UMD2 JEDEC : S0D-323 JEITA : SC-90/A dot (year week factory) 0.7±0.2 0.1 UMD2 zStructure zTaping |
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Rohm |
PIN diode 1) Multiple diodes in one small surface mount package. (UMD3, SMD3) 2) Low high-frequency forward resistance (rF) / low capacitance (CT). 3) High reliability. 0.65 0.65 1.25±0.1 2.1±0.1 0~0.1 +0.1 0.4 − 0.05 +0.1 0.15 − 0.06 RN739F / RN739D D |
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Rohm |
PIN Diodes |
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ROHM |
PIN diode 1) Small mold type. (UMD3) 2) High-frequency resistance witch is small and low capacity. zConstruction Silicon epitaxial planar zExternal dimensions (Unit : mm) 2.0±0.2 0.3±0.1 リードとも Eachlead has same dimension (3) 0.15±0.05 zLand size figure (Un |
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Rohm |
PIN diode 1) Multiple diodes in one small surface mount package. (UMD3, SMD3) 2) Low high-frequency forward resistance (rF) / low capacitance (CT). 3) High reliability. 0.65 0.65 1.25±0.1 2.1±0.1 0~0.1 +0.1 0.4 − 0.05 +0.1 0.15 − 0.06 RN739F / RN739D D |
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ROHM |
PIN diode 1) Small mold type. (SMD3) 2) High reliability. Construction Silicon diffused junction Data Sheet Dimensions (Unit : mm) 2.9±0.2 リードとも 0.4 ＋－00..105 Eachlead has same dimension (3) ＋0.1 0.1 5－0. 06 Land size figure (Unit : mm) 1.9 0.95 0.3～0 |
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ROHM |
PIN Diodes High reliability Small mold type Low rF Low capacitance (AEC-Q101 qualified) Data sheet ●Outline ●Inner Circuit ●Application Auto Gain control circuit ●Structure SILICON DIFFUSED p-n JUNCTION SILICON ●Absolute Maximum Ra |
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