Rectron GLZ fiche technique

No.	Partie #	Fabricant	Description
1	GLZ4.3B	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
2	GLZ43	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
3	GLZ47	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
4	GLZ6.2C	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
5	GLZ6.8A	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
6	GLZ7.5A	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
7	GLZ9.1B	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
8	GLZ10A	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
9	GLZ2.4A	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
10	GLZ5.1B	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
11	GLZ6.2A	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
12	GLZ4.3A	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
13	GLZ51	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
14	GLZ56	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
15	GLZ41	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
16	GLZ39C	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
17	GLZ24B	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
18	GLZ24C	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
19	GLZ27A	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20
20	GLZ27B	Rectron	SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 20