PACELEADER FFM fiche technique

No.	Partie #	Fabricant	Description
1	FFM106-M	PACELEADER	FAST SWITCHING SURFACE MOUNT RECTIFIER • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • High current capability. • Fas
2	FFM104-M	PACELEADER	FAST SWITCHING SURFACE MOUNT RECTIFIER • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • High current capability. • Fas
3	FFM107-M	PACELEADER	FAST SWITCHING SURFACE MOUNT RECTIFIER • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • High current capability. • Fas
4	FFM101-M	PACELEADER	FAST SWITCHING SURFACE MOUNT RECTIFIER • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • High current capability. • Fas
5	FFM102-M	PACELEADER	FAST SWITCHING SURFACE MOUNT RECTIFIER • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • High current capability. • Fas
6	FFM103-M	PACELEADER	FAST SWITCHING SURFACE MOUNT RECTIFIER • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • High current capability. • Fas
7	FFM105-M	PACELEADER	FAST SWITCHING SURFACE MOUNT RECTIFIER • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • High current capability. • Fas