| No. | Partie # | Fabricant | Description | Fiche Technique |
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ON Semiconductor |
SiC Module • Direct Cooling w/ integrated Pin−fin Heatsink • Silicon Nitride Isolator • Tvj.Max = 175°C for Continuous Operation • Automotive Grade SiC MOSFET Chip Technologies • Sintered Die Technology for High Reliability Performance • Easy to Integrate 6−pac |
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ON Semiconductor |
SiC Module |
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ON Semiconductor |
SiC • DIP Silicon Carbide Vienna Rectifier Power Module for On−board Charger (OBC) for xEV Applications • Creepage and Clearance per IEC60664−1, IEC 60950−1 • Compact Design for Low Total Module Resistance • Module Serialization for Full Traceability • L |
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