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ON Semiconductor NFA DataSheet

No. Partie # Fabricant Description Fiche Technique
1
NFAM3512L7B

ON Semiconductor
Intelligent Power Module
including under−voltage lockouts, over−current shutdown, thermal monitoring of drive IC, and fault reporting. The built−in, high−speed HVIC requires only a single supply voltage and translates the incoming logic−level gate inputs to the high−voltage,
Datasheet
2
NFA31512L72

ON Semiconductor
Intelligent Power Module
including under−voltage lockouts, over−current shutdown, thermal monitoring of drive IC, and fault reporting. The built−in, high−speed HVIC requires only a single supply voltage and translates the incoming logic−level gate inputs to the high−voltage,
Datasheet
3
BYM26AGP

Gulf Semiconductor
SINTERED GLASS JUNCTIONFAST SWITCHING PLASTIC RECTIFIER
High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Low leakage cur
Datasheet
4
BYT54M

Gulf Semiconductor
SINTERED GLASS JUNCTIONFAST AVALANCHE RECTIFIER
Glass passivated Hermetically sealed package Low reverse current Soft recovery characteristics SOD-57 MECHANICAL DATA Case: SOD-57 sintered glass case Terminal: Plated axial leads solderable per MIL-STD 202E, method 208C Polarity: color band denote
Datasheet
5
BYM26BGP

Gulf Semiconductor
SINTERED GLASS JUNCTIONFAST SWITCHING PLASTIC RECTIFIER
High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Low leakage cur
Datasheet
6
BYM26CGP

Gulf Semiconductor
SINTERED GLASS JUNCTIONFAST SWITCHING PLASTIC RECTIFIER
High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Low leakage cur
Datasheet
7
BYM26DGP

Gulf Semiconductor
SINTERED GLASS JUNCTIONFAST SWITCHING PLASTIC RECTIFIER
High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Low leakage cur
Datasheet
8
BYM26EGP

Gulf Semiconductor
SINTERED GLASS JUNCTIONFAST SWITCHING PLASTIC RECTIFIER
High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Low leakage cur
Datasheet
9
NFAM0512L5BT

ON Semiconductor
IPM

• Three−phase 1200 V, 5 A IGBT Module with Independent Drivers
• Active Logic Interface
• Built−in Under−voltage Protection (UVP)
• Integrated Bootstrap Diodes and Resistors
• Separate Low−side IGBT Emitter Connections for Individual Current Sensing
Datasheet



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