| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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OCTAVO |
Microprocessor • ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive components integrated into a single package • STM32MP15x Features: o Arm® Cortex®-A7 up to 800MHz x2 o Arm® Cortex®-M4 up to 209MHz o NEON™SIMD Coprocessor x2 o Arm® TrustZone® o US |
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OCTAVO |
Microprocessor • ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive components integrated into a single package • STM32MP15x Features: o Arm® Cortex®-A7 up to 800MHz x2 o Arm® Cortex®-M4 up to 209MHz o NEON™SIMD Coprocessor x2 o Arm® TrustZone® o US |
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OCTAVO |
Microprocessor • ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive components integrated into a single package • STM32MP15x Features: o Arm® Cortex®-A7 up to 800MHz x2 o Arm® Cortex®-M4 up to 209MHz o NEON™SIMD Coprocessor x2 o Arm® TrustZone® o US |
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OCTAVO |
Microprocessor • ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive components integrated into a single package • STM32MP15x Features: o Arm® Cortex®-A7 up to 800MHz x2 o Arm® Cortex®-M4 up to 209MHz o NEON™SIMD Coprocessor x2 o Arm® TrustZone® o US |
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OCTAVO |
C-SiP Processor • TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, eMMC, MEMS Oscillator and passive components integrated into a single package • TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x 2 o USB 2.0 HS OTG + PH |
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OCTAVO |
BAS/IND Processor • TI AM335x, TPS65217C, TL5209, DDR3, and over 140 Passive components integrated into a single package • TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDI |
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OCTAVO |
Processor • TI AM335x, TPS65217C, TL5209, DDR3, EEPROM and passive components integrated into a single package • TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x 2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO |
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