No. | Partie # | Fabricant | Description | Fiche Technique |
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NIC-Components |
Surface Mount Solid Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS *See Part Number System for Details • Pb-FREE (GO |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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NIC |
Surface Mount Solid Polymer Aluminum Electrolytic Capacitors • LOW IMPEDANCE & ESR AT HIGH FREQUENCY RoHS • HIGH RIPPLE CURRENT Compliant • REPLACES MULTIPLE TANTALUM CHIPS IN POWER SUPPLIES includes all homogeneous materials • FITS EIA (7343) “D” LAND PATTERNS • Pb-FREE (GOLD TERMINATION PLATING) *See Part P |
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