| No. | Partie # | Fabricant | Description | Fiche Technique |
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NIC |
Multilayer Ceramic Chip Capacitors • HIGH Q FOR RF APPLICATIONS • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • HIGH VOLTAGE (UP TO 250VDC) • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11 |
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NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE DENSITY • ULTRA LOW ESR & ESL • EXCELLENT MECHANICAL STRENGTH • NICKEL BARRIER TERMINATIONS • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* Temperature Coefficient Capacitance Range Capacitance Tolerance Ope |
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NIC |
Multilayer Ceramic Chip Capacitors • HIGH Q FOR RF APPLICATIONS • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • HIGH VOLTAGE (UP TO 250VDC) • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11 |
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NIC |
Multilayer Ceramic Chip Capacitors • HIGH Q FOR RF APPLICATIONS • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • HIGH VOLTAGE (UP TO 250VDC) • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11 |
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NIC |
Multilayer Ceramic Chip Capacitors • HIGH Q FOR RF APPLICATIONS • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • HIGH VOLTAGE (UP TO 250VDC) • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11 |
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NIC |
Multilayer Ceramic Chip Capacitors • LOWER ESR - HIGH Q at HIGH FREQUENCY • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11B, Wi-Fi, BLUETOOTH, |
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NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE DENSITY • ULTRA LOW ESR & ESL • EXCELLENT MECHANICAL STRENGTH • NICKEL BARRIER TERMINATIONS • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* Temperature Coefficient Capacitance Range Capacitance Tolerance Ope |
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NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE DENSITY • ULTRA LOW ESR & ESL • EXCELLENT MECHANICAL STRENGTH • NICKEL BARRIER TERMINATIONS • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* Temperature Coefficient Capacitance Range Capacitance Tolerance Ope |
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NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE & LOW PROFILE • RoHS COMPLIANT • SAC SOLDER COMPATIBLE RoHS Compliant NMC-T Low Profile Series Includes all homogeneous materials *See Part Number System for Details Temperature Coefficient X7R X5R Y |
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NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE & LOW PROFILE • RoHS COMPLIANT • SAC SOLDER COMPATIBLE RoHS Compliant NMC-T Low Profile Series Includes all homogeneous materials *See Part Number System for Details Temperature Coefficient X7R X5R Y |
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|
NIC |
Multilayer Ceramic Chip Capacitors • HIGH Q FOR RF APPLICATIONS • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • HIGH VOLTAGE (UP TO 250VDC) • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11 |
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|
NIC |
Multilayer Ceramic Chip Capacitors • HIGH Q FOR RF APPLICATIONS • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • HIGH VOLTAGE (UP TO 250VDC) • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11 |
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NIC |
Multilayer Ceramic Chip Capacitors • HIGH Q FOR RF APPLICATIONS • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • HIGH VOLTAGE (UP TO 250VDC) • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11 |
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NIC |
Multilayer Ceramic Chip Capacitors • HIGH Q FOR RF APPLICATIONS • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • HIGH VOLTAGE (UP TO 250VDC) • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11 |
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NIC |
Multilayer Ceramic Chip Capacitors • LOWER ESR - HIGH Q at HIGH FREQUENCY • STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE • EIA 0201, 0402 AND 0603 CASE SIZES • IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS WLANs, HIPERLAN, 802.11A, 802.11B, Wi-Fi, BLUETOOTH, |
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|
NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE DENSITY • ULTRA LOW ESR & ESL • EXCELLENT MECHANICAL STRENGTH • NICKEL BARRIER TERMINATIONS • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* Temperature Coefficient Capacitance Range Capacitance Tolerance Ope |
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|
NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE DENSITY • ULTRA LOW ESR & ESL • EXCELLENT MECHANICAL STRENGTH • NICKEL BARRIER TERMINATIONS • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* Temperature Coefficient Capacitance Range Capacitance Tolerance Ope |
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|
NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE DENSITY • ULTRA LOW ESR & ESL • EXCELLENT MECHANICAL STRENGTH • NICKEL BARRIER TERMINATIONS • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* Temperature Coefficient Capacitance Range Capacitance Tolerance Ope |
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NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE DENSITY • ULTRA LOW ESR & ESL • EXCELLENT MECHANICAL STRENGTH • NICKEL BARRIER TERMINATIONS • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* Temperature Coefficient Capacitance Range Capacitance Tolerance Ope |
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NIC |
Multilayer Ceramic Chip Capacitors • X7R, X5R AND Y5V DIELECTRICS • HIGH CAPACITANCE DENSITY • ULTRA LOW ESR & ESL • EXCELLENT MECHANICAL STRENGTH • NICKEL BARRIER TERMINATIONS • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* Temperature Coefficient Capacitance Range Capacitance Tolerance Ope |
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