No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
|
|
Multicomp |
Zener Diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes Mechanical Data • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Approx. Weight: 0.009 grams Maximum Ratings @ T |
|
|
|
Multicomp |
Surface Mount Zener Diode • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited For Automated Assembly Processes Applications: • Zener diode • Ultra-small surface mount package Maximum Rating @ Ta = 25°C unless otherwise spec |
|
|
|
Multicomp |
Zener Diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes Mechanical Data • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Approx. Weight: 0.009 grams Maximum Ratings @ T |
|
|
|
Multicomp |
Zener Diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes Mechanical Data • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Approx. Weight: 0.009 grams Maximum Ratings @ T |
|
|
|
Multicomp |
Zener Diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes Mechanical Data • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Approx. Weight: 0.009 grams Maximum Ratings @ T |
|
|
|
Multicomp |
Zener Diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes Mechanical Data • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Approx. Weight: 0.009 grams Maximum Ratings @ T |
|
|
|
Multicomp |
PNP General Purpose Transistor • Epitaxial planar die construction. • Complementary NPN type available (MMST5551). • Also available in lead free version. Applications: • Ideal for medium power amplification and switching. 1 Base Collector 3 PNP 2 Emitter Maximum Rating @ T |
|
|
|
Multicomp |
Zener Diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes Mechanical Data • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Approx. Weight: 0.009 grams Maximum Ratings @ T |
|
|
|
Multicomp |
Zener Diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes Mechanical Data • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Approx. Weight: 0.009 grams Maximum Ratings @ T |
|
|
|
Multicomp |
Surface Mount Zener Diode • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes Applications: • Zener diode • Ultra-small surface mount package Maximum Rating @ Ta = 25°C unless otherwis |
|