Microsemi Corporation TSP fiche technique

No.	Partie #	Fabricant	Description
1	TSPDMEDA001-75	Microsemi Corporation	PRODUCT CAPABILITY SHEET • Monolithic Flip Chip Construction, all contacts on one side • Available with solderable surface • Common Anode/Cathode available • Available in 2, 3, 4, 5, 6, 8 element arrays (see outlines below) • Available in 5-8.5 Volt versions • Power Rating i
2	TSPDMEDA001-5	Microsemi Corporation	PRODUCT CAPABILITY SHEET • Monolithic Flip Chip Construction, all contacts on one side • Available with solderable surface • Common Anode/Cathode available • Available in 2, 3, 4, 5, 6, 8 element arrays (see outlines below) • Available in 5-8.5 Volt versions • Power Rating i
3	TSPDMEDA001-85	Microsemi Corporation	PRODUCT CAPABILITY SHEET • Monolithic Flip Chip Construction, all contacts on one side • Available with solderable surface • Common Anode/Cathode available • Available in 2, 3, 4, 5, 6, 8 element arrays (see outlines below) • Available in 5-8.5 Volt versions • Power Rating i