Microsemi Corporation CHF fiche technique

No.	Partie #	Fabricant	Description
1	CHF5KP28	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
2	CHF5KP18A	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
3	CHF5KP20A	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
4	CHF5KP40	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
5	CHF5KP40A	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
6	CHFI5KE82A	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and Bidirectional Fully glass passivated 1500 watt (10/1000 µs) Eliminates wire bonding No overshoot NON Inductive Insertion MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temperature: -55
7	CHFP6KE160	Microsemi Corporation	Patented Flip-Chip Series • • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS • • • • • • • Max Junction Temperature: 1500C
8	CHFP6KE160A	Microsemi Corporation	Patented Flip-Chip Series • • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS • • • • • • • Max Junction Temperature: 1500C
9	CHFP6KE43	Microsemi Corporation	Patented Flip-Chip Series • • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS • • • • • • • Max Junction Temperature: 1500C
10	CHFP6KE70	Microsemi Corporation	Patented Flip-Chip Series • • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS • • • • • • • Max Junction Temperature: 1500C
11	CHFP6KE70A	Microsemi Corporation	Patented Flip-Chip Series • • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS • • • • • • • Max Junction Temperature: 1500C
12	CHF1.5K2300	Microsemi Corporation	FLIP CHIP TVS DIODES • Unidirectional and Bidirectional • Fully glass passivated • 1500 watt (10/1000 µs) • Eliminates wire bonding • No overshoot • NON Inductive Insertion MECHANICAL • Weight: 0.3 grams (approximate) • Cathode mark on top side • Metallization Cr - Ag –
13	CHF1.5KE20A	Microsemi Corporation	FLIP CHIP TVS DIODES • Unidirectional and Bidirectional • Fully glass passivated • 1500 watt (10/1000 µs) • Eliminates wire bonding • No overshoot • NON Inductive Insertion MECHANICAL • Weight: 0.3 grams (approximate) • Cathode mark on top side • Metallization Cr - Ag –
14	CHF1.5KE22	Microsemi Corporation	FLIP CHIP TVS DIODES • Unidirectional and Bidirectional • Fully glass passivated • 1500 watt (10/1000 µs) • Eliminates wire bonding • No overshoot • NON Inductive Insertion MECHANICAL • Weight: 0.3 grams (approximate) • Cathode mark on top side • Metallization Cr - Ag –
15	CHF5KP14	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
16	CHF5KP16	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
17	CHF5KP17A	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
18	CHF5KP18	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
19	CHF5KP22	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper
20	CHF5KP28A	Microsemi Corporation	Patented Flip Chip Series • • • • • • Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping MAXIMUM RATINGS MECHANICAL • • • • • • • Max Junction Temperature: 1750C Storage Temper