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Microsemi 1PM DataSheet

No. Partie # Fabricant Description Fiche Technique
1
1PMT4621

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet
2
1PMT5915B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
3
1PMT5920B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
4
1PMT5924B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
5
1PMT5952B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
6
1PMT4131

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet
7
1PMT4106

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet
8
1PMT4626

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet
9
1PMT4617

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet
10
1PMT5921B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
11
1PMT5923B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
12
1PMT5940B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
13
1PMT5942B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
14
1PMT5943B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
15
1PMT5948B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
16
1PMT5953B

Microsemi
3.0 WATT Zener Diodes
include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment
Datasheet
17
1PMT4135

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet
18
1PMT4134

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet
19
1PMT4133

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet
20
1PMT4122

Microsemi
Powermite Low Noise 1 Watt Zener Diodes
include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance ju
Datasheet



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