Microchip UMX fiche technique

No.	Partie #	Fabricant	Description
1	UMX512	Microchip	MELF PIN Diodes • Low –magnetic (ideal for MRI applications) • Very low inductance, full –face bonding • High –reliability hermetic design • Surface mount devices available in tape and reel • RoHS compliant1 • ESD HMB Class 2 Package Styles Applications • Designed fo
2	UMX508	Microchip	MELF PIN Diodes • Low –magnetic (ideal for MRI applications) • Very low inductance, full –face bonding • High –reliability hermetic design • Surface mount devices available in tape and reel • RoHS compliant1 • ESD HMB Class 2 Package Styles Applications • Designed fo
3	UMX504	Microchip	MELF PIN Diodes • Low –magnetic (ideal for MRI applications) • Very low inductance, full –face bonding • High –reliability hermetic design • Surface mount devices available in tape and reel • RoHS compliant1 • ESD HMB Class 2 Package Styles Applications • Designed fo
4	UMX502	Microchip	MELF PIN Diodes • Low –magnetic (ideal for MRI applications) • Very low inductance, full –face bonding • High –reliability hermetic design • Surface mount devices available in tape and reel • RoHS compliant1 • ESD HMB Class 2 Package Styles Applications • Designed fo
5	UMX509	Microchip	MELF PIN Diodes • Low –magnetic (ideal for MRI applications) • Very low inductance, full –face bonding • High –reliability hermetic design • Surface mount devices available in tape and reel • RoHS compliant1 • ESD HMB Class 2 Package Styles Applications • Designed fo
6	UMX812	Microchip	MELF PIN Diodes • Low –magnetic (ideal for MRI applications) • Very low inductance, full –face bonding • High –reliability hermetic design • Surface mount devices available in tape and reel • RoHS compliant1 • ESD HMB Class 2 Package Styles Applications • Designed fo