MSV UGP fiche technique

No.	Partie #	Fabricant	Description
1	UGP10A	MSV	Glass Passivated Junction Uitra Fast Rectifiers * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Glass passivated chip * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=
2	UGP10D	MSV	Glass Passivated Junction Uitra Fast Rectifiers * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Glass passivated chip * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=
3	UGP10G	MSV	Glass Passivated Junction Uitra Fast Rectifiers * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Glass passivated chip * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=
4	UGP10K	MSV	Glass Passivated Junction Uitra Fast Rectifiers * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Glass passivated chip * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=
5	UGP10B	MSV	Glass Passivated Junction Uitra Fast Rectifiers * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Glass passivated chip * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=
6	UGP10F	MSV	Glass Passivated Junction Uitra Fast Rectifiers * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Glass passivated chip * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=
7	UGP10J	MSV	Glass Passivated Junction Uitra Fast Rectifiers * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Glass passivated chip * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=