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MOSPEC 2KB DataSheet

No. Partie # Fabricant Description Fiche Technique
1
2KBP04M

MOSPEC
2.0A GLASS PASSIVATED BRIDGE RECTIFIER
Glass Passivated Die Construction Typical IR less than 0.1uA High case dielectric strength Ideal for printed circuit boards High Surge Current Capability High temperature soldering guaranteed: 260 /10 second at 5 lbs (2.3kg) tension. MECHANICAL DATA
Datasheet
2
2KBP10M

MOSPEC
2.0A GLASS PASSIVATED BRIDGE RECTIFIER
Glass Passivated Die Construction Typical IR less than 0.1uA High case dielectric strength Ideal for printed circuit boards High Surge Current Capability High temperature soldering guaranteed: 260 /10 second at 5 lbs (2.3kg) tension. MECHANICAL DATA
Datasheet
3
2KBP08M

MOSPEC
2.0A GLASS PASSIVATED BRIDGE RECTIFIER
Glass Passivated Die Construction Typical IR less than 0.1uA High case dielectric strength Ideal for printed circuit boards High Surge Current Capability High temperature soldering guaranteed: 260 /10 second at 5 lbs (2.3kg) tension. MECHANICAL DATA
Datasheet
4
2KBP06M

MOSPEC
2.0A GLASS PASSIVATED BRIDGE RECTIFIER
Glass Passivated Die Construction Typical IR less than 0.1uA High case dielectric strength Ideal for printed circuit boards High Surge Current Capability High temperature soldering guaranteed: 260 /10 second at 5 lbs (2.3kg) tension. MECHANICAL DATA
Datasheet
5
2KBP02M

MOSPEC
2.0A GLASS PASSIVATED BRIDGE RECTIFIER
Glass Passivated Die Construction Typical IR less than 0.1uA High case dielectric strength Ideal for printed circuit boards High Surge Current Capability High temperature soldering guaranteed: 260 /10 second at 5 lbs (2.3kg) tension. MECHANICAL DATA
Datasheet
6
2KBP01M

MOSPEC
2.0A GLASS PASSIVATED BRIDGE RECTIFIER
Glass Passivated Die Construction Typical IR less than 0.1uA High case dielectric strength Ideal for printed circuit boards High Surge Current Capability High temperature soldering guaranteed: 260 /10 second at 5 lbs (2.3kg) tension. MECHANICAL DATA
Datasheet
7
2KBP005M

MOSPEC
2.0A GLASS PASSIVATED BRIDGE RECTIFIER
Glass Passivated Die Construction Typical IR less than 0.1uA High case dielectric strength Ideal for printed circuit boards High Surge Current Capability High temperature soldering guaranteed: 260 /10 second at 5 lbs (2.3kg) tension. MECHANICAL DATA
Datasheet



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