No. | Partie # | Fabricant | Description | Fiche Technique |
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Rectron Semiconductor |
HIGH VOLTAGE ASSEMBLIED RECTIFIER (VOLTAGE 20000 Volts CURRENT 0.35 Amperes) * * * * * * Low cost Low leakage Isolated case Surge overload rating - 50 amperes peak Mounting position: Any Low forward voltage drop 1.515 (38.5) 1.398 (35.5) HVM MECHANICAL DATA * Epoxy : UL flammability classification 94V-0 .052 (1.3) .048 (1.2 |
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MIC |
HIGH VOLTAGE SILICON RECTIFIER ▪ Low leakage ▪ High surge capability ▪ High current capability ▪ High temperature soldering guaranteed: 200 oC/10 seconds, 0.375” (9.5mm) lead length at 5 lbs.(2.3kg) tension. MECHANICAL DATA ▪ Case: Transfer molded plastic ▪ Epoxy: UL94V-0 rate fl |
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MIC |
HIGH VOLTAGE SILICON RECTIFIER ▪ Low leakage ▪ High surge capability ▪ High current capability ▪ High temperature soldering guaranteed: 200 oC/10 seconds, 0.375” (9.5mm) lead length at 5 lbs.(2.3kg) tension. MECHANICAL DATA ▪ Case: Transfer molded plastic ▪ Epoxy: UL94V-0 rate fl |
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Rectron Semiconductor |
HIGH VOLTAGE ASSEMBLIED RECTIFIER * * * * * * Low cost Low leakage Isolated case Surge overload rating - 50 amperes peak Mounting position: Any Low forward voltage drop HVM MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 o C ambient temperature unless otherwise specifi |
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Rectron Semiconductor |
HIGH VOLTAGE ASSEMBLIED RECTIFIER * * * * * * Low cost Low leakage Isolated case Surge overload rating - 50 amperes peak Mounting position: Any Low forward voltage drop HVM MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 o C ambient temperature unless otherwise specifi |
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Hitachi Semiconductor |
Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator • Low forward resistance. (rf = 5.5 max) • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HVM187S Laser Mark H3 Package Code MPAK Pin Arrangement 3 2 1 (Top View) 1 Cathode 2 2 |
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Rectron Semiconductor |
HIGH VOLTAGE ASSEMBLIED RECTIFIER * * * * * * Low cost Low leakage Isolated case Surge overload rating - 50 amperes peak Mounting position: Any Low forward voltage drop HVM MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 o C ambient temperature unless otherwise specifi |
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Hitachi Semiconductor |
Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator • Low forward resistance. (rf = 7.0 max) • Low capacitance. (C = 0.25pFtyp) • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HVM14 Laser Mark H5 Package Code MPAK Pin Arrangement 3 |
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Hitachi Semiconductor |
Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator • Low forward resistance. (rf =7.0Ωmax) • Low capacitance. (C=0.25pF typ) • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HVM14S Laser Mark H6 Package Code MPAK Outline 3 2 1 1 |
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Rectron Semiconductor |
HIGH VOLTAGE ASSEMBLIED RECTIFIER * * * * * * Low cost Low leakage Isolated case Surge overload rating - 50 amperes peak Mounting position: Any Low forward voltage drop HVM MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 o C ambient temperature unless otherwise specifi |
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Hitachi Semiconductor |
Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator • Low forward resistance. (rf = 5.5 max) • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HVM187WK Laser Mark H1 Package Code MPAK Pin Arrangement 3 2 1 (Top View) 1 Anode 2 Ano |
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Hitachi Semiconductor |
Variable Capacitance Diode for FM tuner • High capacitance ratio to wide tuning band width. (C1/C8 = 1.8min) • Low series resistance. • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HVM27WK Laser Mark T5 Package Code MPAK |
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Rectron Semiconductor |
HIGH VOLTAGE ASSEMBLIED RECTIFIER * * * * * * Low cost Low leakage Isolated case Surge overload rating - 50 amperes peak Mounting position: Any Low forward voltage drop HVM MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 o C ambient temperature unless otherwise specifi |
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MIC |
HIGH VOLTAGE SILICON RECTIFIER ▪ Low leakage ▪ High surge capability ▪ High current capability ▪ High temperature soldering guaranteed: 200 oC/10 seconds, 0.375” (9.5mm) lead length at 5 lbs.(2.3kg) tension. MECHANICAL DATA ▪ Case: Transfer molded plastic ▪ Epoxy: UL94V-0 rate fl |
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Rectron Semiconductor |
HIGH VOLTAGE ASSEMBLIED RECTIFIER * * * * * * Low cost Low leakage Isolated case Surge overload rating - 50 amperes peak Mounting position: Any Low forward voltage drop HVM MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 o C ambient temperature unless otherwise specifi |
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Rectron Semiconductor |
HIGH VOLTAGE ASSEMBLIED RECTIFIER |
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Hitachi Semiconductor |
Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator • Low forward resistance. (rf =7.0Ωmax) • Low capacitance. (C=0.25pF typ) • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HVM14SR Laser Mark H7 Package Code MPAK Outline 3 2 1 |
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Hitachi Semiconductor |
Variable Capacitance Diode for FM tuner • Worked by 8V, suitable for small manufacture sources of electric power. • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HVM16 Laser Mark T3 Package Code MPAK Outline 3 2 1 (T |
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MIC |
HIGH VOLTAGE SILICON RECTIFIER ▪ Low leakage ▪ High surge capability ▪ High current capability ▪ High temperature soldering guaranteed: 200 oC/10 seconds, 0.375” (9.5mm) lead length at 5 lbs.(2.3kg) tension. MECHANICAL DATA ▪ Case: Transfer molded plastic ▪ Epoxy: UL94V-0 rate fl |
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