| No. | Partie # | Fabricant | Description | Fiche Technique |
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Excel Semiconductor |
Boot Sector Flash Memory – A hardware method of locking a sector to prevent any program or erase operations within that sector – Sectors can be locked in-system or via programming equipment – Temporary Sector Unprotect feature allows code changes in previously locked sectors |
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Excel Semiconductor |
16Mbit CMOS 3.0 Volt Flash Memory • Memory Protection - W# pin works in conjunction with Status Register Bits to protect specified memory areas - Status Register Block Protection Bits (BP2, BP1, BP0) in status register configure parts of memory as read only SOFTWARE FEATURES • SPI B |
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Thinki Semiconductor |
(ES2AA - ES2JA) 2.0 AMPERE SURFACE MOUNT SUPER FAST RECTIFIERS For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Superfast recovery time for high efficiency High temperature soldering: O 260 C/10 seconds at terminals Plastic material used |
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MIC |
SURFACE MOUNT SUPERFAST RECOVERY RECTIFIER |
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Excel Semiconductor |
Boot Sector Flash Memory • Single power supply operation - 2.7V -3.6V for read, program and erase operations • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC SOFTWARE FEATURES • Sector Structure - 16Kbyte x 1, 8Kbyte x 2, 32Kbyte x 1 boot |
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Excel Semiconductor |
Boot Sector Flash Memory • Single power supply operation - 2.7V -3.6V for read, program and erase operations • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC SOFTWARE FEATURES • Sector Structure - 16Kbyte x 1, 8Kbyte x 2, 32Kbyte x 1 boot |
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Micro Commercial Components |
2 Amp Super Fast Recovery Silicon Rectifier For Mount Applications Surface Extremely Low Thermal Resistance Easy Pick And Place High Temp Soldering: 250 °C for 10 Seconds At Terminals Superfast Recovery Times For High Efficiency • • • Maximum Ratings Operating |
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Sangdest Microelectronics |
MOUNT SUPER FAST RECTIFIER Glass Passivated Die Construction Ideally Suited for Automatic Assembly Low Forward Overload Drop, High Efficiency Low Power Loss Super-Fast Recovery Time Plastic Case Material has UL Flammability Classification Rating 94V-O This is a P |
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Sangdest Microelectronics |
MOUNT SUPER FAST RECTIFIER Glass Passivated Die Construction Ideally Suited for Automatic Assembly Low Forward Overload Drop, High Efficiency Low Power Loss Super-Fast Recovery Time Plastic Case Material has UL Flammability Classification Rating 94V-O This is a P |
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Taiwan Semiconductor |
Surface Mount Super Fast Rectifiers - Glass passivated junction chip - Ideal for automated placement - Low profile package - Low power loss, high efficiency - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 MECHANI |
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Excel Semiconductor |
Boot Sector Flash Memory • Single power supply operation - 2.7V -3.6V for read, program and erase operations • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC SOFTWARE FEATURES • Sector Structure - 16Kbyte x 1, 8Kbyte x 2, 32Kbyte x 1 boot |
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Thinki Semiconductor |
(ES2AA - ES2JA) 2.0 AMPERE SURFACE MOUNT SUPER FAST RECTIFIERS For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Superfast recovery time for high efficiency High temperature soldering: O 260 C/10 seconds at terminals Plastic material used |
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Taiwan Semiconductor |
Surface Mount Super Fast Rectifiers ● Glass passivated chip junction ● Ideal for automated placement ● Low profile package ● Super fast recovery time for high efficiency ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21 APP |
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Taiwan Semiconductor |
Super Fast Rectifier ● AEC-Q101 qualified ● Glass passivated chip junction ● Ideal for automated placement ● Low profile package ● Super fast recovery time for high efficiency ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according |
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Micro Commercial Components |
2 Amp Super Fast Recovery Silicon Rectifier For Mount Applications Surface Extremely Low Thermal Resistance Easy Pick And Place High Temp Soldering: 250 °C for 10 Seconds At Terminals Superfast Recovery Times For High Efficiency • • • Maximum Ratings Operating |
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Fairchild Semiconductor |
2.0 Ampere Superfast Rectifiers • • • • • • For surface mount applications. Glass passivated junction. Low profile package. Easy pick and place. Built-in strain relief. Superfast recovery times for high efficiency. 0.050 (1.270) 0.030 (0.762) 0.008 (0.203) 0.004 (0.102) 0.220 (5.58 |
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General Semiconductor |
SURFACE MOUNT FAST EFFICIENT PLASTIC RECTIFIER 0.086 (2.20) 0.077 (1.95) 0.155 (3.94) 0.130 (3.30) 0.180 (4.57) 0.160 (4.06) 0.012 (0.305) 0.006 (0.152) 0.096 (2.44) 0.084 (2.13) ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ For surface mount applications ♦ |
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Jingdao Microelectronics |
Surface Mount Superfast Recovery Rectifier • Easy pick and place • For surface mounted applications • Low profile package • Built-in strain relief • Superfast recovery times for high efficiency MECHANICAL DATA • Case: SOD-123FL • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. We |
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MIC |
SURFACE MOUNT SUPERFAST RECOVERY RECTIFIER ▪ For surface mounted applications ▪ Low profile package ▪ Glass Passivated Chip Junction ▪ Superfast reverse recovery time ▪ Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA ▪ Case: SMAF ▪ Terminals: Solderable per MIL-STD-750, |
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Sangdest Microelectronics |
MOUNT SUPER FAST RECTIFIER Glass Passivated Die Construction Ideally Suited for Automatic Assembly Low Forward Overload Drop, High Efficiency Low Power Loss Super-Fast Recovery Time Plastic Case Material has UL Flammability Classification Rating 94V-O This is a P |
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