No. | Partie # | Fabricant | Description | Fiche Technique |
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MEI |
SURFACE MOUNT BRIDGE RECTIFIER Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2) |
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MEI |
SURFACE MOUNT BRIDGE RECTIFIER Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2) |
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MEI |
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER • High forward surge current capability • Glass passivated chip junction • High case dielectric strength • High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA • Case: Transfer molded plastic • Terminal: Lead solderable per MIL- |
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MEI |
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER • High forward surge current capability • Glass passivated chip junction • High case dielectric strength • High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA • Case: Transfer molded plastic • Terminal: Lead solderable per MIL- |
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|
MEI |
SURFACE MOUNT BRIDGE RECTIFIER Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2) |
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|
MEI |
SURFACE MOUNT BRIDGE RECTIFIER Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2) |
|
|
|
MEI |
SURFACE MOUNT BRIDGE RECTIFIER Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2) |
|
|
|
MEI |
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER • High forward surge current capability • Glass passivated chip junction • High case dielectric strength • High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA • Case: Transfer molded plastic • Terminal: Lead solderable per MIL- |
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|
|
MEI |
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER • High forward surge current capability • Glass passivated chip junction • High case dielectric strength • High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA • Case: Transfer molded plastic • Terminal: Lead solderable per MIL- |
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|
|
MEI |
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER • High forward surge current capability • Glass passivated chip junction • High case dielectric strength • High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA • Case: Transfer molded plastic • Terminal: Lead solderable per MIL- |
|
|
|
MEI |
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER • High forward surge current capability • Glass passivated chip junction • High case dielectric strength • High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA • Case: Transfer molded plastic • Terminal: Lead solderable per MIL- |
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