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MEI DF0 DataSheet

No. Partie # Fabricant Description Fiche Technique
1
DF08S

MEI
SURFACE MOUNT BRIDGE RECTIFIER
Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2)
Datasheet
2
DF06S

MEI
SURFACE MOUNT BRIDGE RECTIFIER
Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2)
Datasheet
3
DF02M

MEI
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER

• High forward surge current capability
• Glass passivated chip junction
• High case dielectric strength
• High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA
• Case: Transfer molded plastic
• Terminal: Lead solderable per MIL-
Datasheet
4
DF005M

MEI
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER

• High forward surge current capability
• Glass passivated chip junction
• High case dielectric strength
• High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA
• Case: Transfer molded plastic
• Terminal: Lead solderable per MIL-
Datasheet
5
DF04S

MEI
SURFACE MOUNT BRIDGE RECTIFIER
Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2)
Datasheet
6
DF02S

MEI
SURFACE MOUNT BRIDGE RECTIFIER
Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2)
Datasheet
7
DF01S

MEI
SURFACE MOUNT BRIDGE RECTIFIER
Glass passivated chip junction Ideal for surface mounted applications Low leakage High forward surge current capability. High temperature soldering guaranteed: 260/10 seconds at terminals. Case Style DFS 0.047 (1.20) 0.040 (1.02) 0.205 (5.2)
Datasheet
8
DF08M

MEI
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER

• High forward surge current capability
• Glass passivated chip junction
• High case dielectric strength
• High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA
• Case: Transfer molded plastic
• Terminal: Lead solderable per MIL-
Datasheet
9
DF06M

MEI
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER

• High forward surge current capability
• Glass passivated chip junction
• High case dielectric strength
• High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA
• Case: Transfer molded plastic
• Terminal: Lead solderable per MIL-
Datasheet
10
DF04M

MEI
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER

• High forward surge current capability
• Glass passivated chip junction
• High case dielectric strength
• High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA
• Case: Transfer molded plastic
• Terminal: Lead solderable per MIL-
Datasheet
11
DF01M

MEI
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER

• High forward surge current capability
• Glass passivated chip junction
• High case dielectric strength
• High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA
• Case: Transfer molded plastic
• Terminal: Lead solderable per MIL-
Datasheet



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