| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
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|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
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|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
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|
MCC |
Surface Mount Glass Passivated Rectifier • Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information) • Halogen free available upon request by adding suffix "-HF" • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • High Surge |
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|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
|
|
|
|
MCC |
TVS • Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty |
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