| No. | Partie # | Fabricant | Description | Fiche Technique |
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MCC |
500mW Zener Diode x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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MCC |
Zener Diode x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 • |
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MCC |
200mW Zener Diode x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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MCC |
500mW Zener Diode x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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MCC |
Zener Diode x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 • |
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MCC |
Zener Diode x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 • |
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MCC |
Zener Diode x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 • |
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|
MCC |
Zener Diode x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 • |
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|
MCC |
Zener Diode x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 • |
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MCC |
Zener Diode • Ultra-Small Leadless Surface Mount Package • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Ideally Suited fou Automated Assembly Processes • Lead Free Finish/Rohs Compliant ("P"Suffix designates RoHS Compliant. See orde |
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MCC |
500mW Zener Diode • Small surface mounting type • High reliability BZT55C2V0 THRU BZT55C75 500 mW Zener Diode 2.0 to 75 Volts Absolute Maximum Ratings Symbol PD IZ TJ TSTG Rating Power dissipation Z-current Junction Temperature Storage Temperature Range Rating 50 |
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MCC |
200mW Zener Diode x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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|
MCC |
200mW Zener Diode x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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|
MCC |
200mW Zener Diode x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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|
MCC |
200mW Zener Diode x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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|
MCC |
500mW Zener Diode x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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|
MCC |
500mW Zener Diode x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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|
MCC |
500mW Zener Diode x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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MCC |
500mW Zener Diode x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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MCC |
500mW Zener Diode x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Ro |
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