| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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KOA Speer Electronics |
hybrid IC • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding (COB) • Various types of package are available • High reliability achieved by KOA’s original thick film technology • Thick film printed circuit su |
|
|
|
|
KOA Speer Electronics |
hybrid IC • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding (COB) • Various types of package are available • High reliability achieved by KOA’s original thick film technology • Thick film printed circuit su |
|