Jingdao Microelectronics P4S fiche technique

No.	Partie #	Fabricant	Description
1	P4SMAFJ5.0	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
2	P4SMAFJ12	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
3	P4SMAFJ12A	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
4	P4SMAFJ15A	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
5	P4SMAFJ17	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
6	P4SMAFJ26	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
7	P4SMAFJ12C	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
8	P4SMAFJ14CA	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
9	P4SMAFJ48A	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
10	P4SMAFJ58A	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
11	P4SMAFJ180	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
12	P4SMAFJ45CA	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
13	P4SMAFJ70C	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
14	P4SMAFJ75C	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
15	P4SMAFJ100CA	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
16	P4SMAFJ110CA	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
17	P4SMAFJ130C	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
18	P4SMAFJ6.5A	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
19	P4SMAFJ7.0	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe
20	P4SMAFJ7.5A	Jingdao Microelectronics	Surface mount transient voltage suppressor power 400 watts • For surface mounted applications in order to optimize board space. • Low profile package • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability MECHANICAL DATA • Case: SMAF • Terminals: Solderable pe