JINAN JINGHENG ELECTRONICS MM3 fiche technique

No.	Partie #	Fabricant	Description
1	MM3Z7V5	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
2	MM3Z3V3	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
3	MM3Z2V2	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
4	MM3Z4V3	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
5	MM3Z6V8	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
6	MM3Z11	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
7	MM3Z22	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
8	MM3Z82	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
9	MM3Z3V0	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
10	MM3Z3V6	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
11	MM3Z3V9	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
12	MM3Z5V1	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
13	MM3Z5V6	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
14	MM3Z9V1	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
15	MM3Z10	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
16	MM3Z12	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
17	MM3Z13	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
18	MM3Z16	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
19	MM3Z20	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200
20	MM3Z24	JINAN JINGHENG ELECTRONICS	0.3W SILICON PLANAR ZENER DIODES Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5% JF High temperature soldering guaranteed:260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/EC and WEEE 200