| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
|
|
|
Infineon |
Maxi IPM Package • Fully isolated Dual In-Line molded module • Very low thermal resistance due to DCB substrate • Lead-free terminal plating; RoHS compliant Inverter • 1200 V TRENCHSTOPTM IGBT7 S7 • Rugged 1200 V SOI gate driver technology with stability agai |
|
|
|
|
Infineon |
Maxi IPM Package • Fully isolated Dual In-Line molded module • Very low thermal resistance due to DCB substrate • Lead-free terminal plating; RoHS compliant Inverter • 1200 V TRENCHSTOPTM IGBT7 S7 • Rugged 1200 V SOI gate driver technology with stability agai |
|