| No. | Partie # | Fabricant | Description | Fiche Technique |
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Infineon |
IGBT • CoolSiC(TM)Schottkydiodegen5 • Increasedblockingvoltagecapabilityupto650V • Lowinductivedesign • Lowswitchinglosses MechanicalFeatures • Al2O3substratewithlowthermalresistance • IntegratedNTCtemperaturesensor • PressFITcont |
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Infineon |
IGBT • CoolSiC(TM)Schottkydiodegen5 • Increasedblockingvoltagecapabilityupto650V • Lowinductivedesign • Lowswitchinglosses MechanicalFeatures • Al2O3substratewithlowthermalresistance • IntegratedNTCtemperaturesensor • Soldercontac |
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Infineon |
IGBT • ExtendedOperationTemperatureTvjop • LowSwitchingLosses • LowVCEsat • Tvjop=150°C • VCEsatwithpositiveTemperatureCoefficient MechanicalFeatures • IsolatedBasePlate • StandardHousing ModuleLabelCode BarcodeCode128 DMX-Code p |
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Infineon |
IGBT • CoolSiC(TM)Schottkydiodegen5 • HighspeedIGBTH3 • Lowswitchinglosses • thinQHSiCSchottkydiode1200V MechanicalFeatures • 3kVAC1mininsulation • Al2O3substratewithlowthermalresistance • IntegratedNTCtemperaturesensor • Compa |
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Infineon |
IGBT • HighspeedIGBTH3 • Lowswitchinglosses MechanicalFeatures • 3kVAC1mininsulation • Al2O3substratewithlowthermalresistance • IntegratedNTCtemperaturesensor • Compactdesign • PressFITcontacttechnology ModuleLabelCode BarcodeCode |
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Infineon |
IGBT • ExtendedOperationTemperatureTvjop • HighDCStability • High Short Circuit Capability, Self Limiting Short CircuitCurrent • VCEsatwithpositiveTemperatureCoefficient • LowVCEsat MechanicalFeatures • 4kVAC1minInsulation • Packagewith |
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Infineon |
IGBT • ExtendedoperatingtemperatureTvjop • HighDCstability • Highcurrentdensity • Lowswitchinglosses • LowVCEsat • Tvjop=150°C MechanicalFeatures • PackagewithCTI>400 • Highcreepageandclearancedistances • Highpowerandthermalcycl |
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Infineon |
MOSFET • Highcurrentdensity • Lowinductivedesign MechanicalFeatures • IntegratedNTCtemperaturesensor • PressFITcontacttechnology • Rugged mounting due to integrated mounting clamps • Pre-appliedThermalInterfaceMaterial ModuleLabelCode Barcod |
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Infineon |
MOSFET • Highcurrentdensity • Lowinductivedesign MechanicalFeatures • IntegratedNTCtemperaturesensor • PressFITcontacttechnology • Rugged mounting due to integrated mounting clamps ModuleLabelCode BarcodeCode128 DMX-Code ContentoftheCod |
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Infineon |
IGBT • ExtendedOperationTemperatureTvjop • HighDCStability • HighCurrentDensity • LowSwitchingLosses • LowVCEsat • Tvjop=150°C • EnlargedDiodeforregenerativeoperation MechanischeEigenschaften • GehäusemitCTI>400 • GroßeLuft-undK |
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Infineon |
IGBT • ExtendedoperatingtemperatureTvjop • HighDCstability • Highcurrentdensity • Lowswitchinglosses • LowVCEsat • Tvjop=150°C MechanicalFeatures • PackagewithCTI>400 • Highcreepageandclearancedistances • Highpowerandthermalcycl |
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