| No. | Partie # | Fabricant | Description | Fiche Technique |
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IXYS Corporation |
HIgh Power Diode Modules q Direct copper bonded Al O -ceramic 23 base plate q Planar passivated chips q Isolation voltage 3600 V~ q UL registered, E 72873 Applications q Supplies for DC power equipment q DC supply for PWM inverter q Field supply for DC motors q Battery DC po |
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IXYS Corporation |
HIgh Power Diode Direct copper bonded Al2O3 -ceramic base plate Planar passivated chips Isolation voltage 3600 V~ UL registered, E 72873 q q q q òi2dt Applications Supplies for DC power equipment DC supply for PWM inverter Field supply for DC motors Battery DC powe |
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IXYS Corporation |
HIgh Power Diode Modules • Direct copper bonded Al2O3 -ceramic base plate • Planar passivated chips • Isolation voltage 3600 V~ • UL registered, E 72873 Applications • Supplies for DC power equipment • DC supply for PWM inverter • Field supply for DC motors • Battery DC powe |
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|
IXYS Corporation |
HIgh Power Diode Modules • Direct copper bonded Al2O3 -ceramic base plate • Planar passivated chips • Isolation voltage 3600 V~ • UL registered, E 72873 Applications • Supplies for DC power equipment • DC supply for PWM inverter • Field supply for DC motors • Battery DC powe |
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|
|
IXYS Corporation |
HIgh Power Diode Modules • Direct copper bonded Al2O3 -ceramic base plate • Planar passivated chips • Isolation voltage 3600 V~ • UL registered, E 72873 Applications • Supplies for DC power equipment • DC supply for PWM inverter • Field supply for DC motors • Battery DC powe |
|
|
|
|
IXYS Corporation |
HIgh Power Diode Modules q Direct copper bonded Al O -ceramic 23 base plate q Planar passivated chips q Isolation voltage 3600 V~ q UL registered, E 72873 Applications q Supplies for DC power equipment q DC supply for PWM inverter q Field supply for DC motors q Battery DC po |
|
|
|
|
IXYS Corporation |
HIgh Power Diode Modules q Direct copper bonded Al O -ceramic 23 base plate q Planar passivated chips q Isolation voltage 3600 V~ q UL registered, E 72873 Applications q Supplies for DC power equipment q DC supply for PWM inverter q Field supply for DC motors q Battery DC po |
|
|
|
|
IXYS Corporation |
HIgh Power Diode Modules q Direct copper bonded Al O -ceramic 23 base plate q Planar passivated chips q Isolation voltage 3600 V~ q UL registered, E 72873 Applications q Supplies for DC power equipment q DC supply for PWM inverter q Field supply for DC motors q Battery DC po |
|
|
|
|
IXYS Corporation |
HIgh Power Diode • Direct copper bonded Al2O3 -ceramic base plate • Planar passivated chips • Isolation voltage 3600 V~ • UL registered, E 72873 Applications • Supplies for DC power equipment • DC supply for PWM inverter • Field supply for DC motors • Battery DC powe |
|
|
|
|
IXYS Corporation |
HIgh Power Diode Modules • Direct copper bonded Al2O3 -ceramic base plate • Planar passivated chips • Isolation voltage 3600 V~ • UL registered, E 72873 Applications • Supplies for DC power equipment • DC supply for PWM inverter • Field supply for DC motors • Battery DC powe |
|
|
|
|
IXYS Corporation |
HIgh Power Diode Modules • Direct copper bonded Al2O3 -ceramic base plate • Planar passivated chips • Isolation voltage 3600 V~ • UL registered, E 72873 Applications • Supplies for DC power equipment • DC supply for PWM inverter • Field supply for DC motors • Battery DC powe |
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