| No. | Partie # | Fabricant | Description | Fiche Technique |
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IXYS Corporation |
High Power Diode Modules International standard package Direct copper bonded Al2O3-ceramic with copper base plate Planar passivated chips Isolation voltage 3600 V~ UL registered E 72873 q q q q q I2t TVJ = 45°C VR = 0 TVJ = TVJM VR = 0 Applications Supplies for DC power e |
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IXYS Corporation |
Phase-leg Rectifier Diode ● International standard packages JEDEC TO-247 AD and TO-268 AA surface mountable ● For single and three phase bridge configuration ● Planar passivated chips ● Epoxy meets UL 94V-0 flammability classification ● Version AR isolated and UL registered E |
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IXYS Corporation |
Fast Recovery Epitaxial Diode (FRED) Module International standard package with DCB ceramic base plate Planar passivated chips Short recovery time Low switching losses Soft recovery behaviour Isolation voltage 3600 V~ UL registered E 72873 q q q q q q q TVJ = 150°C; t = 10 ms (50 Hz), sine t |
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