No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
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Hamamatsu Corporation |
Si PIN photodiode l Large active area S5980: 5 × 5 mm S5981: 10 × 10 mm S5870: 10 × 10 mm l Chip carrier package suitable for surface mounting Facilitates automated surface mounting by solder reflow l Thin package: 1.26 mmt l Photo sensitivity: 0.72 A/W (λ=960 nm) s |
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|
|
Hamamatsu Corporation |
NMOS multichannel detector head |
|
|
|
Hamamatsu Corporation |
NMOS multichannel detector head |
|
|
|
Hamamatsu Corporation |
NMOS multichannel detector head |
|
|
|
Hamamatsu Corporation |
NMOS multichannel detector head |
|
|
|
Hamamatsu Corporation |
NMOS multichannel detector head |
|
|
|
Hamamatsu Corporation |
NMOS multichannel detector head |
|
|
|
Hamamatsu Corporation |
Si PIN photodiode l Large active area S5980: 5 × 5 mm S5981: 10 × 10 mm S5870: 10 × 10 mm l Chip carrier package suitable for surface mounting Facilitates automated surface mounting by solder reflow l Thin package: 1.26 mmt l Photo sensitivity: 0.72 A/W (λ=960 nm) s |
|