No. | Partie # | Fabricant | Description | Fiche Technique |
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HOTTECH |
ZENER DIODES Low cost Smal lsize Glass sealed MECHANICAL DATA Case: LL34 glass case Terminals: solderable per MIL - STD - 202, method 208 Polarity:color band denotes cathode Mounting position:any Weight:0.05 grams Glass-Encapsulate Diodes ZMM2V0---ZMM75 Cathode |
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HOTTECH |
ZENER DIODES Low cost Smal lsize Glass sealed MECHANICAL DATA Case: LL34 glass case Terminals: solderable per MIL - STD - 202, method 208 Polarity:color band denotes cathode Mounting position:any Weight:0.05 grams Glass-Encapsulate Diodes ZMM2V0---ZMM75 Cathode |
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HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
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HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
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HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
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HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
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|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
ZENER DIODES Low cost Smal lsize Glass sealed MECHANICAL DATA Case: LL34 glass case Terminals: solderable per MIL - STD - 202, method 208 Polarity:color band denotes cathode Mounting position:any Weight:0.05 grams Glass-Encapsulate Diodes ZMM2V0---ZMM75 Cathode |
|
|
|
HOTTECH |
ZENER DIODES Low cost Smal lsize Glass sealed MECHANICAL DATA Case: LL34 glass case Terminals: solderable per MIL - STD - 202, method 208 Polarity:color band denotes cathode Mounting position:any Weight:0.05 grams Glass-Encapsulate Diodes ZMM2V0---ZMM75 Cathode |
|
|
|
HOTTECH |
ZENER DIODES Low cost Smal lsize Glass sealed MECHANICAL DATA Case: LL34 glass case Terminals: solderable per MIL - STD - 202, method 208 Polarity:color band denotes cathode Mounting position:any Weight:0.05 grams Glass-Encapsulate Diodes ZMM2V0---ZMM75 Cathode |
|
|
|
HOTTECH |
ZENER DIODES Low cost Smal lsize Glass sealed MECHANICAL DATA Case: LL34 glass case Terminals: solderable per MIL - STD - 202, method 208 Polarity:color band denotes cathode Mounting position:any Weight:0.05 grams Glass-Encapsulate Diodes ZMM2V0---ZMM75 Cathode |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
|
|
|
HOTTECH |
Plastic-Encapsulate Diodes • Total power dissipation : max. 300 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5% Absolute Maximum Ratings (Ta = 25 OC) Parameter Power Dissipation Junction Temperature Storage Temperature Range Charac |
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