HITANO BZT fiche technique

No.	Partie #	Fabricant	Description
1	BZT52C4V7	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
2	BZT52C3V9	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
3	BZT52C5V1	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
4	BZT52C13	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
5	BZT52C2V7	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
6	BZT52C3V3	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
7	BZT52C3V6	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
8	BZT52C9V1	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
9	BZT52C16	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
10	BZT52C18	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
11	BZT52C20	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
12	BZT52C30	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
13	BZT52C33	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
14	BZT52C36	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
15	BZT52C2V4	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
16	BZT52C3V0	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
17	BZT52C4V3	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
18	BZT52C5V6	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
19	BZT52C6V2	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208
20	BZT52C6V8	HITANO	SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208