| No. | Partie # | Fabricant | Description | Fiche Technique |
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Globaltech |
Ultra Low Capacitance 2-Line ESD Protection Array |
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Globaltech |
Surface Mount TVS Ultra Low Capacitance : 0.5 pF Low Clamping Voltage Small Body Outline Dimensions : 0.039” x 0.024” (1.00 mm x 0.60 mm) Low Body Height : 0.016” (0.4mm) Stand-off Voltage : 5V Low Leakage Response Time is Typically < 1.0 ns IEC61000-4 |
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Globaltech |
Ultra-low Capacitance Bidirectional Micro Packaged TVS Diodes Max. peak pulse power : PPP=20W at tP=8/20us Stand-off Voltage : 5.0V Low capacitance (<0.5pF) for high-speed interfaces No insertion loss to 3.0GHz Replacement for MLV Protects I/O Port Low Clamping Voltage Low Leakage Solid-state |
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Globaltech |
Ultra-low Capacitance Dual Bidirectional ESD Protection Diodes Two lines ESD protection diodes Stand-off Voltage : 5.0V 2.8pF Low capacitance for variety I/O ports Response time < 1ns Low Clamping Voltage Low Leakage current Solid-state silicon avalanche technology IEC61000-4-2(ESD) ±15kV (air), |
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Globaltech |
Ultra Low Capacitance 4-Channel ESD Protection Array Stand off Voltage: 5 V Peak Power up to 180 Watts @ 8 x 20 us Pulse Low Leakage current IEC61000-4-2 |
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Globaltech |
Ultra Low Capacitance Single-Line ESD Protection Array Peak Reverse Working Voltage: 5V Low leakage current High ESD protection Level: >+/-15KV per HBM IEC61000-4-2 Level 4 ESD Protection |
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Globaltech |
Ultra Low Capacitance 4-Channel ESD Protection Array Protects up to four I/O lines (Data lines) Stand-off voltage : 5.0V Max. peak pulse power : PPP=120W at tP=8/20us Low capacitance : 0.3pF typical (I/O to I/O) Low clamping voltage IEC 61000-4-2, level 4 ( ESD ), > ±15KV ( air ) ; > ±8KV ( |
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Globaltech |
Ultra Low Capacitance 4-Channel ESD Protection Array Flow-through design Protects four I/O lines (Data line) Stand-off voltage : 5.0V Max. peak pulse power : PPP = 50W at tP = 8/20us Low capacitance : 0.3pF typical (I/O to I/O) IEC 61000-4-2, level 4 ( ESD ), > ±15KV ( air ) ; > ±8KV ( cont |
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Globaltech |
Surface Mount TVS For surface mounted application in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Fast response time: typically less than 1.0ps from 0V to |
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