No. | Partie # | Fabricant | Description | Fiche Technique |
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General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
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General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
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General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
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General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
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|
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General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
|
|
|
General Semiconductor |
Automotive Transient Voltage Suppressors • Designed for under the hood applications 0.034 (0.86) • Plastic package has Underwriters Laboratory 0.028 (0.71) DIA. Flammability Classification 94V-0 • Exclusive patented PAR® oxide passivated chip construction 1.0 (25.4) min. • 600W peak |
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