| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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General Semiconductor |
Small Surface Mount Ultrafast Rectifiers • • • • For surface mounted applications Low profile package Ideal for automated placement High temperature soldering: 250°C/10 seconds at terminals C Maximum Ratings and Thermal Characteristics (T Parameter Device marking code Maximum repetitive pe |
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General Semiconductor |
Small Surface Mount Ultrafast Rectifiers • • • • For surface mounted applications Low profile package Ideal for automated placement High temperature soldering: 250°C/10 seconds at terminals C Maximum Ratings and Thermal Characteristics (T Parameter Device marking code Maximum repetitive pe |
|
|
|
|
General Semiconductor |
Small Surface Mount Ultrafast Rectifiers • • • • For surface mounted applications Low profile package Ideal for automated placement High temperature soldering: 250°C/10 seconds at terminals C Maximum Ratings and Thermal Characteristics (T Parameter Device marking code Maximum repetitive pe |
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