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GOOD-ARK FZ1 DataSheet

No. Partie # Fabricant Description Fiche Technique
1
FZ1120

GOOD-ARK
Surface Mount Zener Diodes

• Toal power dissipation:max,1.0W
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile, typical thickness 1.0mm
• For use in stabilizing and clipping circuits with high power rating eSGA (SOD‐1
Datasheet
2
FZ1180

GOOD-ARK
Surface Mount Zener Diodes

• Toal power dissipation:max,1.0W
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile, typical thickness 1.0mm
• For use in stabilizing and clipping circuits with high power rating eSGA (SOD‐1
Datasheet
3
FZ1200

GOOD-ARK
Surface Mount Zener Diodes

• Toal power dissipation:max,1.0W
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile, typical thickness 1.0mm
• For use in stabilizing and clipping circuits with high power rating eSGA (SOD‐1
Datasheet
4
FZ1160

GOOD-ARK
Surface Mount Zener Diodes

• Toal power dissipation:max,1.0W
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile, typical thickness 1.0mm
• For use in stabilizing and clipping circuits with high power rating eSGA (SOD‐1
Datasheet
5
FZ1130

GOOD-ARK
Surface Mount Zener Diodes

• Toal power dissipation:max,1.0W
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile, typical thickness 1.0mm
• For use in stabilizing and clipping circuits with high power rating eSGA (SOD‐1
Datasheet
6
FZ1110

GOOD-ARK
Surface Mount Zener Diodes

• Toal power dissipation:max,1.0W
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile, typical thickness 1.0mm
• For use in stabilizing and clipping circuits with high power rating eSGA (SOD‐1
Datasheet
7
FZ1150

GOOD-ARK
Surface Mount Zener Diodes

• Toal power dissipation:max,1.0W
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile, typical thickness 1.0mm
• For use in stabilizing and clipping circuits with high power rating eSGA (SOD‐1
Datasheet



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