| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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GALAXY ELECTRICAL |
SURFACE MOUNT RECTIFIER Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded construction MECHANICAL DATA Case:JEDEC DO-213AB,molded plastic over passivated chip Terminals:Solder Plated, solderable per MIL-STD-750, Method |
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GALAXY ELECTRICAL |
SURFACE MOUNT RECTIFIER Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded construction MECHANICAL DATA Case:JEDEC DO-213AB,molded plastic over passivated chip Terminals:Solder Plated, solderable per MIL-STD-750, Method |
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GALAXY ELECTRICAL |
SURFACE MOUNT RECTIFIER Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded construction MECHANICAL DATA Case:JEDEC DO-213AB,molded plastic over passivated chip Terminals:Solder Plated, solderable per MIL-STD-750, Method |
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|
|
|
GALAXY ELECTRICAL |
SURFACE MOUNT RECTIFIER Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded construction MECHANICAL DATA Case:JEDEC DO-213AB,molded plastic over passivated chip Terminals:Solder Plated, solderable per MIL-STD-750, Method |
|
|
|
|
GALAXY ELECTRICAL |
SURFACE MOUNT RECTIFIER Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded construction MECHANICAL DATA Case:JEDEC DO-213AB,molded plastic over passivated chip Terminals:Solder Plated, solderable per MIL-STD-750, Method |
|
|
|
|
GALAXY ELECTRICAL |
SURFACE MOUNT RECTIFIER Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded construction MECHANICAL DATA Case:JEDEC DO-213AB,molded plastic over passivated chip Terminals:Solder Plated, solderable per MIL-STD-750, Method |
|
|
|
|
GALAXY ELECTRICAL |
SURFACE MOUNT RECTIFIER Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded construction MECHANICAL DATA Case:JEDEC DO-213AB,molded plastic over passivated chip Terminals:Solder Plated, solderable per MIL-STD-750, Method |
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