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Fujitsu BA- DataSheet

No. Partie # Fabricant Description Fiche Technique
1
BAL-D6W-K

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
2
MB9BF106NA

Fujitsu
32-bit ARM Cortex-M3 based Microcontroller
32-bit ARM Cortex-M3 Core
・Processor version: r2p0
・Up to 80MHz Frequency Operation
・Memory Protection Unit (MPU): improve the reliability of an embedded system
・Integrated Nested Vectored Interrupt Controller (NVIC): 1 NMI (non-maskable interrupt) a
Datasheet
3
BA4.5WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
4
MBM29LV800BA

Fujitsu Media Devices
8M (1M X 8/512K X 16) BIT

• Single 3.0 V read, program, and erase Minimizes system level power requirements
• Compatible with JEDEC-standard commands Uses same software commands as E2PROMs
• Compatible with JEDEC-standard world-wide pinouts 48-pin TSOP(I) (Package suffix: PFT
Datasheet
5
BA24WK

Fujitsu
MINIATURE RELAY
Datasheet
6
BA12WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
7
MBM29LV800BA-90

Fujitsu
8M (1M X 8/512K X 16) BIT FLASH MEMORY

• Single 3.0 V read, program, and erase Minimizes system level power requirements
• Compatible with JEDEC-standard commands Uses same software commands as E2PROMs
• Compatible with JEDEC-standard world-wide pinouts 48-pin TSOP(I) (Package suffix: PFT
Datasheet
8
BA1.5WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
9
BA24WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
10
BA48WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
11
MB9BF102RA

Fujitsu
32-bit ARM Cortex-M3 based Microcontroller
32-bit ARM Cortex-M3 Core
・Processor version: r2p0
・Up to 80MHz Frequency Operation
・Memory Protection Unit (MPU): improve the reliability of an embedded system
・Integrated Nested Vectored Interrupt Controller (NVIC): 1 NMI (non-maskable interrupt) a
Datasheet
12
MBM29DL800BA-12

Fujitsu
8M (1M x 8/512K x 16) BIT FLASH MEMORY

• Single 3.0 V read, program, and erase Minimizes system level power requirements
• Simultaneous operations Read-while-Erase or Read-while-Program
• Compatible with JEDEC-standard commands Uses same software commands as E2PROMs
• Compatible with JEDE
Datasheet
13
MBM29LV800BA-70

Fujitsu
8M (1M X 8/512K X 16) BIT FLASH MEMORY

• Single 3.0 V read, program, and erase Minimizes system level power requirements
• Compatible with JEDEC-standard commands Uses same software commands as E2PROMs
• Compatible with JEDEC-standard world-wide pinouts 48-pin TSOP(I) (Package suffix: PFT
Datasheet
14
BA3WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
15
BA5WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
16
BA6WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
17
BAL3WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
18
BAL6WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
19
BALD3WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet
20
BALD6WK

Fujitsu
MINIATURE RELAY
q q q q q q q q q Slim type relay for high density mounting CSA recognized Conforms to IEC60950, Bellcore specification and FCC Part 68 —Clearance more than 2.0 mm between coil and contacts —Creepage more than 2.5 mm between coil and contacts —Diel
Datasheet



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