Formosa MS GDZ fiche technique

No.	Partie #	Fabricant	Description
1	GDZ6.8B	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
2	GDZ7.5A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
3	GDZ10D	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
4	GDZ15C	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
5	GDZ18A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
6	GDZ20D	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
7	GDZ33A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
8	GDZ2.7A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
9	GDZ3.3A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
10	GDZ3.6A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
11	GDZ3.6B	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
12	GDZ3.9A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
13	GDZ3.9B	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
14	GDZ4.7B	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
15	GDZ5.1B	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
16	GDZ5.1C	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
17	GDZ5.6A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
18	GDZ7.5B	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
19	GDZ12A	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method
20	GDZ18C	Formosa MS	Zener diode • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-750, Method